डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
SOT545-3 | plastic thermal enganced thin quad flat package ( DataSheet : www.DataSheet4U.com )
PDF: 2004 Feb 05
Philips Semiconductors
Package outline
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
SOT545-3
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NXP |
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SOT545-3 | plastic thermal enganced thin quad flat package | NXP |
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