डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
SOT527-1 | Package outline PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad
SOT527-1
D
E
A
X
c y exposed d |
NXP |
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SOT527-1 | Package outline | NXP |
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