डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
SOT263 | Package outline PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220
SOT263
E P
A A1 q
D1
D
mounting base
L3 m L L2
L1 Q
1
e b
5
w |
NXP |
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SOT263 | Package outline | NXP |
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SOT262A1 | Flanged double-ended ceramic package | Philips |
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