| No. | Partie # | Fabricant | Description | Fiche Technique |
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IXYS Corporation |
Polar Power MOSFET HiPerFET • Silicon chip on Direct-Copper-Bond Maximum lead temperature for soldering Plastic body for 10s 50/60 Hz, RMS, 1 minute Mounting force 300 260 2500 20..120/4.5..27 5 • • • • • substrate - High power dissipation - Isolated mounting surface - 250 |
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