DIP24 डाटा शीट PDF( Datasheet )
डेटा पत्रक ( Datasheet PDF ) |
| भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
| DIP24 | Thermal Data ®
Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm |
 STMicroelectronics |
|
| DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
 MEDER |
|
| DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
|
| DIP24-1Bxx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
|
| DIP24-2Axx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
शेयर लिंक :
[1]
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