डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
DIP20 | Thermal Data ®
Thermal Data
DIP 20
20 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver glue ) epoxy resin
0.25 mm 10- |
ETC |
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DIP20 | Thermal Data | ETC |
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DIP24-1Bxx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
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DIP24 | Thermal Data | STMicroelectronics |
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DIP24-2Axx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
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DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays | MEDER |
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DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
www.DataSheet.in | 2017 | संपर्क |