डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
CPQ165 | TRIAC 25 Amp PROCESS
www.DataSheet4U.com
CPQ165
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEO |
Central Semiconductor |
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CPQ165 | TRIAC 25 Amp | Central Semiconductor |
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CPQ166 | TRIAC | centralsemi |
www.DataSheet.in | 2017 | संपर्क |