डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
CPQ057 | TRIAC 2.0 Amp PROCESS
www.DataSheet4U.com
CPQ057
TRIAC
2.0 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GE |
Central Semiconductor |
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CPQ057 | TRIAC 2.0 Amp | Central Semiconductor |
www.DataSheet.in | 2017 | संपर्क |