डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
CP324 | Small Signal Transistor PROCESS
Small Signal MOSFET Transistor
N- Channel Enhancement-Mode Transistor Chip
CP324
PROCESS DETAILS Process Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Bac |
Central Semiconductor |
|
CP324 | Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip PROCESS
Small Signal MOSFET Transistor
N- Channel Enhancement-Mode Transistor Chip
CP324
PROCESS DETAILS Process Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Bac |
Central Semiconductor |
www.DataSheet.in | 2017 | संपर्क |