डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
TOIM3232 | Infrared IrDA Integrated Interface Circuits TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm)
Description
|
TEMIC Semiconductors |
|
TOIM3232 | Infrared IrDA Integrated Interface Circuits TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm)
Description
|
TEMIC Semiconductors |
|
TOIM3232 | Infrared IrDA Integrated Interface Circuits TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micronic channel length (0.8 mm)
Description
|
TEMIC Semiconductors |
|
TOIM3232 | Integrated Interface Circuits TOIM3232
Vishay Telefunken
Integrated Interface Circuits
ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length (0.8 mm)
Description
Th |
Vishay Siliconix |
www.DataSheet.in | 2017 | संपर्क |