डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
CPD89V | High Current Diode PROCESS
CPD89V
Switching Diode
High Current Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 12.8 x 12.8 MILS 7.1 |
centralsemi |
|
CPD89V | High Current Diode | centralsemi |
www.DataSheet.in | 2017 | संपर्क |