| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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Microsemi Corporation |
FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag – |
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Microsemi Corporation |
FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag – |
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