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LTM4609 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - High Efficiency Buck-Boost DC/DC uModule Regulator - Linear Technology

भाग संख्या LTM4609
समारोह High Efficiency Buck-Boost DC/DC uModule Regulator
मैन्युफैक्चरर्स Linear Technology 
लोगो Linear Technology लोगो 
पूर्व दर्शन
1 Page
		
<?=LTM4609?> डेटा पत्रक पीडीएफ

LTM4609 pdf
LTM4609
Absolute Maximum Ratings
(Note 1)
VIN.............................................................. –0.3V to 36V
VOUT.............................................................. 0.8V to 36V
INTVCC, EXTVCC, RUN, SS, PGOOD............... –0.3V to 7V
SW1, SW2 (Note 7)....................................... –5V to 36V
VFB............................................................. –0.3V to 2.4V
COMP........................................................... –0.3V to 2V
FCB, STBYMD........................................ –0.3V to INTVCC
PLLIN......................................................... –0.3V to 5.5V
PLLFLTR..................................................... –0.3V to 2.7V
INTVCC................................................................. –40mA
Operating Temperature Range (Note 2)
E- and I-grades.....................................–40°C to 85°C
MP-grade............................................ –55°C to 125°C
Junction Temperature............................................ 125°C
Storage Temperature Range....................–55°C to 125°C
Solder Temperature (Note 3).................................. 245°C
Pin Configuration (See Table 6 Pin Assignment)
TOP VIEW SW2
(BANK 2)
M
L
SW1
(BANK 4) K
VIN
(BANK 1)
J
VOUT H
(BANK 5)
G
INTVCC
EXTVCC
F
E
RSENSE
(BANK 3)
PGND D
(BANK 6) C
PGOOD
VFB B
A
SENSESS SGND RUN FCB
COMP
PLLFLTR
PLLIN
1 2 3 4 5 6 7 8 9 10 11 12
SENSE+
STBYMD
LGA PACKAGE
141-LEAD (15mm × 15mm × 2.82mm)
TJMAX = 125°C, θJA = 11.4°C/W, θJCtop = 15°C/W, θJCbottom = 4°C/W, WEIGHT = 1.5g
TOP VIEW SW2
(BANK 2)
M
L
SW1
(BANK 4) K
VIN
(BANK 1)
J
VOUT H
(BANK 5)
G
INTVCC
EXTVCC
F
E
RSENSE
(BANK 3)
PGND D
(BANK 6) C
PGOOD
VFB B
A
SENSESS SGND RUN FCB
COMP
PLLFLTR
PLLIN
1 2 3 4 5 6 7 8 9 10 11 12
SENSE+
STBYMD
BGA PACKAGE
141-LEAD (15mm × 15mm × 3.42mm)
TJMAX = 125°C, θJA = 11.4°C/W, θJCtop = 15°C/W, θJCbottom = 4°C/W, WEIGHT = 1.7g
Order Information
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE
FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM4609EV#PBF
Au (RoHS)
LTM4609V
e4
LGA 3 –40°C to 85°C
LTM4609IV#PBF
Au (RoHS)
LTM4609V
e4
LGA 3 –40°C to 85°C
LTM4609MPV#PBF
Au (RoHS)
LTM4609V
e4
LGA 3 –55°C to 125°C
LTM4609EY#PBF
SAC305 (RoHS)
LTM4609Y
e1
BGA 3 –40°C to 85°C
LTM4609IY#PBF
SAC305 (RoHS)
LTM4609Y
e1
BGA 3 –40°C to 85°C
LTM4609IY
SnPb (63/37)
LTM4609Y
e0
BGA 3 –40°C to 85°C
LTM4609MPY #PBF
SAC305 (RoHS)
LTM4609Y
e1
BGA 3 –55°C to 125°C
LTM4609MPY
SnPb (63/37)
LTM4609Y
e0
BGA 3 –55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
2
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
For more information www.linear.com/LTM4609
4609ff

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डाउनलोड[ LTM4609 Datasheet.PDF ]


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