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FDP085N10A डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - N-Channel PowerTrench MOSFET - micross

भाग संख्या FDP085N10A
समारोह N-Channel PowerTrench MOSFET
मैन्युफैक्चरर्स micross 
लोगो micross लोगो 
पूर्व दर्शन
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<?=FDP085N10A?> डेटा पत्रक पीडीएफ

FDP085N10A pdf
Dynamic Characteristics4, TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
gFS
ESR
Ciss
Coss
Crss
Coss(er)
Qg(tot)
Qgs
Qgs2
Qgd
Forward Transconductance
Equivalent Series Resistance (G-S)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Energy Related Output Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
VDS = 10V, ID = 96A
f = 1MHz
VDS =50V, VGS = 0V
f = 1MHz
VDS =50V, VGS = 0V
VDS =50V, ID = 96A
VGS = 10V5
-
-
-
-
-
-
-
-
-
-
Typ
72
0.97
2025
468
20
752
31
9.7
5.0
7.5
Max
-
-
2695
620
-
-
40
-
-
-
Units
S
pF
pF
pF
pF
nC
nC
nC
nC
Switching Characteristics4, TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
td(on) Turn-On Delay Time
- 18 46 ns
tr
td(off)
Turn-On Rise Time
Turn-Off Delay Time
VDD = 50V, ID = 96A
VGS = 10V RGEN = 4.7Ω5
- 22 54 ns
- 29 68 ns
tf Turn-Off Fall Time
- 8 26 ns
Drain-Source Diode Characteristics4, TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
IS
Maximum Continuous Drain to Source Diode Forward Current
- - 96
ISM
Maximum Pulsed Drain to Source Diode Forward Current
- - 384
VSD Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 96A
- - 1.3
trr
Reverse Recovery Time
VDD=50V, VGS =0V, ISD =96A
-
59
-
Qrr Reverse Recovery Charge
dIF/dt = 100A/μs
- 80 -
Notes:
4. Characterised by design & tested at component level, not subject to production test at wafer level
5. Essentially independent of Operating Temperature Typical Characteristics
A
A
V
ns
nC
Ordering Guide
Part Number
Format
Detail / Drawing
FDP085N10AMW
Un-sawn wafer, electrical rejects inked
Page 3
FDP085N10AMWF
Sawn wafer on film-frame
Page 4
FDP085N10AMD
Singulated die / chips in waffle pack
Page 4
Note: Singulated Die / Chips can also be supplied in Pocket Tape or SurfTape® on request
Further Information - Contact your Micross sales office or email your enquiry to baredie@micross.com
©2014 Fairchild Semiconductor Corporation & Micross Components

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