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APL5930 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Ultra Low Dropout (0.23V Typical) Linear Regulator - ANPEC

भाग संख्या APL5930
समारोह Ultra Low Dropout (0.23V Typical) Linear Regulator
मैन्युफैक्चरर्स ANPEC 
लोगो ANPEC लोगो 
पूर्व दर्शन
1 Page
		
<?=APL5930?> डेटा पत्रक पीडीएफ

APL5930 pdf
APL5930
Ordering and Marking Information
APL5930
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5930 KA :
APL5930
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN Supply Voltage (VIN to GND)
-0.3 ~ 4.0
V
VCNTL
VCNTL Supply Voltage (VCNTL to GND)
-0.3 ~ 7
V
VOUT
VOUT to GND Voltage
-0.3 ~ VIN +0.3
V
POK to GND Voltage
-0.3 ~ 7
V
EN, FB to GND Voltage
-0.3 ~ VCNTL +0.3
V
PD
TJ
TSTG
TSDR
Power Dissipation
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
3
150
-65 ~ 150
260
W
oC
oC
oC
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
Junction-to-Case Resistance in Free Air (Note 3)
SOP-8P
SOP-8P
Typical Value
42
18
Unit
oC/W
oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of SOP-8P is soldered directly on the PCB.
Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.
18
2 VIN 7
36
45
Measured Point
PCB Copper
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Sep., 2009
2
www.anpec.com.tw

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