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MAX15068 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Single Hot-Swap Controller - Maxim Integrated Products

भाग संख्या MAX15068
समारोह Single Hot-Swap Controller
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
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<?=MAX15068?> डेटा पत्रक पीडीएफ

MAX15068 pdf
MAX15068
Dual ORing, Single Hot-Swap Controller with
Accurate Current Monitoring
Absolute Maximum Ratings
IN1, IN2 to GND........................................................-1V to +24V
PG, EN, FAULT, CSN to GND...............................-0.3V to +24V
CSP to GND.............................Max (-0.3V, VIN_ - 0.6V) to +24V
VS to GND................................................................-0.3V to +6V
ON, PC, IPMON, CB, CDLY to GND...........-0.3V to (VS + 0.3V)
CSP to CSN..........................................................-0.3V to +0.3V
OUT to GND...........................................................-0.3V to +24V
GATE to GND.........................................................-0.3V to +36V
GATE to OUT.........................................................-0.3V to +20V
CP1 to GND...........................................................-0.3V to +36V
CP1 to IN1..............................................................-0.3V to +14V
CP2 to GND...........................................................-0.3V to +36V
CP2 to IN2..............................................................-0.3V to +14V
OG1..............................................(VIN1 - 0.3V) to (VCP1 + 0.3V)
OG2..............................................(VIN2 - 0.3V) to (VCP2 + 0.3V)
Current into EN, PG, FAULT...............................................20mA
Continuous Power Dissipation (TA = +70°C)
20-Pin TQFN (derate 30mW/ºC above +70°C)..........2400mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 20-PIN TQFN
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
T2045+1C
21-0726
90-100091
33.5°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN1 = VIN2 = 12V, CIN1 = CIN2 = CVS = 1µF, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER
SUPPLY VOLTAGE
Input Supply Voltage
Input Supply Current
Internal LDO Output Voltage
VS Undervoltage Lockout
VS Undervoltage-Lockout
Hysteresis
SYMBOL
CONDITIONS
VIN
IIN
VS
VUVLO
VUVLO_HYS
Hot swap and ORing
Current monitor
VS rising
MIN TYP MAX UNITS
2.9 18
V
4.8 18
4 mA
4.8 5 5.25 V
2.5 2.65 2.8
V
0.07 V
CSP Undervoltage Lockout
VCSP_UVLO
VCSP rising
VCSP falling
2.4 2.49 2.58
2.25 2.35 2.42
V
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