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FDM2452NZ डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Monolithic Common Drain N-Channel 2.5V Specified PowerTrench MOSFET - Fairchild Semiconductor

भाग संख्या FDM2452NZ
समारोह Monolithic Common Drain N-Channel 2.5V Specified PowerTrench MOSFET
मैन्युफैक्चरर्स Fairchild Semiconductor 
लोगो Fairchild Semiconductor लोगो 
पूर्व दर्शन
1 Page
		
<?=FDM2452NZ?> डेटा पत्रक पीडीएफ

FDM2452NZ pdf
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown
Voltage
BVDSS
TJ
IDSS
IGSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage,
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
Gate Threshold Voltage
Temperature Coefficient
RDS(on)
Static Drain–Source
On–Resistance
gFS Forward Transconductance
Dynamic Characteristics
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
RG Gate Resistance
VGS = 0 V,
ID = 250 µA
ID = 250 µA, Referenced to 25°C
VDS = 24 V, VGS = 0 V
VGS = ±12 V, VDS = 0 V
VDS = VGS,
ID = 250 µA
ID = 250 µA, Referenced to 25 C
VGS = 4.5 V, ID = 8.1 A
VGS = 4.0 V, ID = 8.0 A
VGS = 3.1 V, ID = 7.7 A
VGS = 2.5 V, ID = 7.4 A
VGS = 4.5 V, ID = 8.1 A, TJ=125°C
VDS = 5 V,
ID =8.1 A
VDS = 15 V,
f = 1.0 MHz
V GS = 0 V,
V GS = 0 V, f = 1.0 MHz
30 V
24 mV/°C
1 µA
±10 µA
0.55 0.8 1.5
V
–3 mV/°C
13.6
13.9
14.6
15.7
19
46
21
21.5
23
25
31
m
S
980 pF
160 pF
110 pF
1.8
Switching Characteristics (Note 2)
td(on) Turn–On Delay Time
tr Turn–On Rise Time
td(off) Turn–Off Delay Time
tf Turn–Off Fall Time
Qg Total Gate Charge
Qgs Gate–Source Charge
Qgd Gate–Drain Charge
VDD = 15 V, ID = 1 A,
VGS = 4.5 V, RGEN = 6
VDS = 15 V,
VGS = 4.5 V
ID = 8.1 A,
9 18
10 20
30 48
8.7 17
14 19
1.8
3.8
ns
ns
ns
ns
nC
nC
nC
Drain–Source Diode Characteristics
VSD Drain–Source Diode Forward
Voltage
trr Diode Reverse Recovery Time
Qrr Diode Reverse Recovery Charge
VGS = 0 V, IS = 1.8 A
IF = 8.1 A,
dIF/dt = 100 A/µs
(Note 2)
0.7 1.2
15
4
V
nS
nC
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 55°C/W when
mounted on a 1in2 pad
of 2 oz copper
b) 145°C/W when mounted on a
minimum pad of 2 oz copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs,
Duty Cycle < 2.0%
3. The diode connected between the gate
and source serves only as protection
againts ESD. No gate overvoltage
rating is implied.
FDM2452NZ Rev C1

विन्यास 6 पेज
डाउनलोड[ FDM2452NZ Datasheet.PDF ]


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अनुशंसा डेटापत्रक

भाग संख्याविवरणविनिर्माण
FDM2452NZMonolithic Common Drain N-Channel 2.5V Specified PowerTrench MOSFETFairchild Semiconductor
Fairchild Semiconductor


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