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XC2C32 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - (XC2C32 - XC2C512) Coolrunner-ii CPLD Family - Xilinx

भाग संख्या XC2C32
समारोह (XC2C32 - XC2C512) Coolrunner-ii CPLD Family
मैन्युफैक्चरर्स Xilinx 
लोगो Xilinx लोगो 
पूर्व दर्शन
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<?=XC2C32?> डेटा पत्रक पीडीएफ

XC2C32 pdf
CoolRunner-II CPLD Family
R
Table 2: CoolRunner-II CPLD DC Characteristics
XC2C32A XC2C64A
ICC (μA), 0 MHz, 25°C (typical)
ICC (mA), 50 MHz, 70°C (max)
1. ICC is dynamic current.
16
2.5
17
5
XC2C128
19
10
XC2C256
21
27
XC2C384
23
45
XC2C512
25
55
Table 2 shows key DC characteristics for the CoolRunner-II
family.
Table 3 shows the CoolRunner-II CPLD package offering
with corresponding I/O count. All packages are surface
mount, with over half of them being ball-grid technologies.
The ultra tiny packages permit maximum functional capacity
in the smallest possible area. The CMOS technology used
in CoolRunner-II CPLDs generates minimal heat, allowing
the use of tiny packages during high-speed operation.
With the exception of the Pb-free QF packages, there are at
least two densities present in each package with three in the
VQ100 (100-pin 1.0mm QFP), TQ144 (144-pin 1.4mm
QFP), and FT256 (256-ball 1.0mm spacing FLBGA). The
FT256 is particularly important for slim dimensioned porta-
ble products with mid- to high-density logic requirements.
Table 3: CoolRunner-II CPLD Family Packages and I/O Count
QFG32(1)
XC2C32A
21
XC2C64A
-
XC2C128
-
XC2C256
-
VQ44
VQG44(1)
QFG48(1)
33
33
-
33
33
37
-
-
-
-
-
-
CP56
CPG56(1)
33
33
45
45
-
-
-
-
VQ100
VQG100(1)
-
-
64 80 80
64 80 80
CP132
CPG132(1)
-
-
- 100 106
- 100 106
TQ144
TQG144(1)
-
-
- 100 118
- 100 118
PQ208
-
-
- 173
PQG208(1)
-
-
- 173
FT256 - - - 184
FTG256(1)
-
-
- 184
FG324
-
-
--
FGG324(1)
-
-
-
-
Notes:
1. The letter "G" as the third character indicates a Pb-free package.
XC2C384
-
-
-
-
-
-
-
-
-
-
118
118
173
173
212
212
240
240
XC2C512
-
-
-
-
-
-
-
-
-
-
-
-
173
173
212
212
270
270
Table 4 details the distribution of advanced features across
the CoolRunner-II CPLD family. The family has uniform
basic features with advanced features included in densities
where they are most useful. For example, it is very unlikely
that four I/O banks are needed on 32 and 64 macrocell
parts, but very likely they are for 384 and 512 macrocell
parts. The I/O banks are groupings of I/O pins using any
one of a subset of compatible voltage standards that share
2
www.xilinx.com
DS090 (v3.1) September 11, 2008
Product Specification

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अनुशंसा डेटापत्रक

भाग संख्याविवरणविनिर्माण
XC2C32(XC2C32 - XC2C512) Coolrunner-ii CPLD FamilyXilinx
Xilinx
XC2C32ACoolRunner-II CPLDXilinx
Xilinx


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