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XC2V1000-6FG456C डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Field-Programmable Gate Arrays - Xilinx

भाग संख्या XC2V1000-6FG456C
समारोह Field-Programmable Gate Arrays
मैन्युफैक्चरर्स Xilinx 
लोगो Xilinx लोगो 
पूर्व दर्शन
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XC2V1000-6FG456C pdf
Virtex-II 1.5V Field-Programmable Gate Arrays
R
Table 1: Virtex-II Field-Programmable Gate Array Family Members
CLB
(1 CLB = 4 slices = Max 128 bits)
Device
System Array
Gates Row x Col.
Slices
Maximum
Distributed
RAM Kbits
Multiplier
Blocks
XC2V40
40K 8 x 8 256
8
4
XC2V80
80K 16 x 8 512
16
8
XC2V250
250K
24 x 16
1,536
48
24
XC2V500
500K
32 x 24
3,072
96
32
XC2V1000
1M
40 x 32 5,120
160
40
XC2V1500 1.5M
48 x 40
7,680
240
48
XC2V2000
2M
56 x 48 10,752
336
56
XC2V3000
3M
64 x 56 14,336
448
96
XC2V4000
4M
80 x 72 23,040
720
120
XC2V6000
6M
96 x 88 33,792
1,056
144
XC2V8000
8M 112 x 104 46,592
1,456
168
Notes:
1. See details in Table 2, Maximum Number of User I/O Pads.
SelectRAM Blocks
18-Kbit Max RAM
Blocks (Kbits)
4 72
8 144
24 432
32 576
40 720
48 864
56 1,008
96 1,728
120 2,160
144 2,592
168 3,024
DCMs
4
4
8
8
8
8
8
12
12
12
12
Max I/O
Pads(1)
88
120
200
264
432
528
624
720
912
1,104
1,108
General Description
The Virtex-II family is a platform FPGA developed for high
performance from low-density to high-density designs that
are based on IP cores and customized modules. The family
delivers complete solutions for telecommunication, wire-
less, networking, video, and DSP applications, including
PCI, LVDS, and DDR interfaces.
The leading-edge 0.15µm / 0.12µm CMOS 8-layer metal
process and the Virtex-II architecture are optimized for high
speed with low power consumption. Combining a wide vari-
ety of flexible features and a large range of densities up to
10 million system gates, the Virtex-II family enhances pro-
grammable logic design capabilities and is a powerful alter-
native to mask-programmed gates arrays. As shown in
Table 1, the Virtex-II family comprises 12 members, ranging
from 40K to 10M system gates.
Packaging
Offerings include ball grid array (BGA) packages with
0.80mm, 1.00mm, and 1.27mm pitches. In addition to tradi-
tional wire-bond interconnects, flip-chip interconnect is used
in some of the BGA offerings. The use of flip-chip intercon-
nect offers more I/Os than is possible in wire-bond versions
of the similar packages. Flip-Chip construction offers the
combination of high pin count with high thermal capacity.
Table 2 shows the maximum number of user I/Os available.
The Virtex-II device/package combination table (Table 6 at
the end of this section) details the maximum number of I/Os
for each device and package using wire-bond or flip-chip
technology.
Table 2: Maximum Number of User I/O Pads
Device
Wire-Bond
Flip-Chip
XC2V40
88
XC2V80
120
XC2V250
200
XC2V500
264
XC2V1000
328 432
XC2V1500
392 528
XC2V2000
456 624
XC2V3000
516 720
XC2V4000
912
XC2V6000
1,104
XC2V8000
1,108
Module 1 of 4
2
www.xilinx.com
1-800-255-7778
DS031-1 (v1.7) October 2, 2001
Advance Product Specification

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