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QID0640020 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - IGBT Module - Powerex

भाग संख्या QID0640020
समारोह IGBT Module
मैन्युफैक्चरर्स Powerex 
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QID0640020 pdf
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
QID0640020
Dual IGBTMOD™ NX-Series Module
400 Amperes/600 Volts
Absolute Maximum Ratings, Tj = 25°C unless otherwise specified
Characteristics
Power Device Junction Temperature
Storage Temperature
Mounting Torque, M5 Mounting Screws
Mounting Torque, M6 Main Terminal Screws
Module Weight (Typical)
Baseplate Flatness, On Centerline X, Y (See Below)
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal
Symbol
Tj
Tstg
VISO
QID0640020
-40 to 150
-55 to 130
31
40
220
±0 ~ +100
2500
Inverter Sector
Collector-Emitter Voltage (G-E Short)
VCES
600
Gate-Emitter Voltage (C-E Short)
VGES
±20
Collector Current (TC = 60°C)*1
IC 400
Peak Collector Current (Pulse)*3
ICM
800
Emitter Current (TC = 25°C)*1*4
IE*2
400
Peak Emitter Current (Pulse)*3
IEM*2
800
Maximum Collector Dissipation (TC = 25°C)*1*4
PC 1115
*1 Case temperature (TC) and heatsink temperature (Tf) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 IE, IEM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
*3 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed Tj(max) rating.
*4 Junction temperature (Tj) should not increase beyond Tj(max) rating.
Units
°C
°C
in-lb
in-lb
Grams
µm
Volts
Volts
Volts
Amperes
Amperes
Amperes
Amperes
Watts
BASEPLATE FLATNESS
MEASUREMENT POINT
Y
X
– : CONCAVE
+ : CONVEX
HEATSINK SIDE
CHIP LOCATION (TOP VIEW)
Chip Location (Top View)
IGBT FWDi NTC Thermistor
0
21.5
32.0
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
47
Th
24
48 23
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
0
21.5
30.0
43.6
Dimensions in mm (Tolerance: ±1mm)
2 04/10 Rev. 0

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डाउनलोड[ QID0640020 Datasheet.PDF ]


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